钎焊性
The paper presents the comparison of printed circuit board solder ability test results measured before and after cleaning.
本文比较了印刷电路板在清洗表面之前和之后的焊接能力测量结果。
A special high-performance flux-cored solder shows its superiority in solder-ability and low corrosion.
本树脂芯焊锡丝具有极强的焊接能力和较低的腐蚀性.
The analytical results show that the solder material, contact area and processing quality of solder layer will be main factors restricting the ability of thermal dispersion for flip-chip configuration LEDs.
研究表明,焊接层的材料、焊接接触面的面积和焊接层的质量是制约倒装焊LED芯片散热能力的主要因素;
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